All Products

72V231L10PFG

32 Terminations3.3V 32 Pin FIFO memory IC6.5 ns Min 3V VMax 3.6V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V231L10PFG
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 193
  • Description: 32 Terminations3.3V 32 Pin FIFO memory IC6.5 ns Min 3V VMax 3.6V V(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Tin
Mount Surface Mount
Package / Case TQFP
Number of Pins 32
Published 2008
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 32
ECCN Code EAR99
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Subcategory FIFOs
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.8mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 32
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Element Configuration Dual
Nominal Supply Current 20mA
Max Supply Current 20mA
Frequency (Max) 100MHz
Access Time 6.5 ns
Organization 2KX9
Density 18 kb
Standby Current-Max 0.005A
Parallel/Serial PARALLEL
Sync/Async Synchronous
Word Size 9b
Memory IC Type OTHER FIFO
Bus Directional Unidirectional
FWFT Support No
Programmable Flags Support Yes
Output Enable YES
Cycle Time 10 ns
Height Seated (Max) 1.6mm
Length 7mm
Width 7mm
Thickness 1.4mm
RoHS Status RoHS Compliant
Lead Free Lead Free

72V231L10PFG Overview


The TQFP package contains FIFO memory chip.A Surface Mount mounting method is recommended.It is possible to achieve high efficiency with a supply voltage of 3.3V .A total of 32 terminations can be found in FIFO means.32 pins are the operation pins.FIFO design requires 20mA amps of current to operate.A 3.3V supply voltage will ensure FIFO's maximum efficiency.To ensure reliabilFIFOy, FIFO runs at a minimum working temperature of 0°C degrees Celsius.An operating temperature of 70°C °C is necessary for stable operation.The gadget is self-contained and can be found in FIFOs .There is a memory type OTHER FIFO in the IC of this part.It is possible to operate the FIFO memory chip at very low supply voltages, such as 3V volts.A maximum supply voltage of 3.6V volts can be handled by the FIFO memory chip.Approximately 32 pins are attached to it.In the presence of a 100MHz frequency, it can maintain good accuracy.Normally, the FIFO memory's maximum value is 100MHz .

72V231L10PFG Features


FIFOs category
Frequency at most

72V231L10PFG Applications


There are a lot of Integrated Device Technology (IDT) 72V231L10PFG FIFOs Memory applications.

  • Code converters
  • PC peripheral
  • General Data Collection Applications at Extreme High-Temperatures
  • Video
  • Communications
  • Buses
  • Routers
  • Communications Systems
  • Wireless
  • SPD for DDR3 Memory Modules