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  • 72V251L10J8

72V251L10J8

3.3V 32 Pin FIFO memory IC6.5 ns Min 3V VMax 3.6V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V251L10J8
  • Package: PLCC
  • Datasheet: PDF
  • Stock: 344
  • Description: 3.3V 32 Pin FIFO memory IC6.5 ns Min 3V VMax 3.6V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case PLCC
Number of Pins 32
Published 2005
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 100MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Element Configuration Dual
Nominal Supply Current 20mA
Max Supply Current 20mA
Frequency (Max) 100MHz
Access Time 6.5 ns
Direction Unidirectional
Density 72 kb
Sync/Async Synchronous
Word Size 9b
Bus Directional Unidirectional
Retransmit Capability No
FWFT Support No
Programmable Flags Support Yes
Length 13.97mm
Width 11.43mm
Thickness 2.79mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72V251L10J8 Overview


The PLCC package contains FIFO memory chip.Mounting it in Surface Mount is recommended.As far as the operation pins are concerned, they are 32 pins.There is a maximum current requirement of 20mA for its operation.For FIFO's maximum efficiency, the supply voltage should be set to 3.3V .During operation, a minimum temperature of 0°C degrees Celsius should be maintained in order to ensure reliability.By operating at a temperature of 70°C °C, the FIFO products is capable of stable operation.If the supply voltage is very low, such as 3V V, FIFO may be able to operate.A maximum supply voltage of 3.6V V can be handled by this FIFO memory chip.In spite of the frequency 100MHz , it is capable of maintaining a good level of accuracy.Normally, the FIFO memory's maximum value is 100MHz .

72V251L10J8 Features


Frequency at most

72V251L10J8 Applications


There are a lot of Integrated Device Technology (IDT) 72V251L10J8 FIFOs Memory applications.

  • Product traceability
  • Extended product life cycle
  • Cameras
  • Transistors
  • Video Processing
  • Network switching/routing
  • Temporary storage elements
  • Alarm System
  • Seismic Data Collection at Extreme Temperatures
  • Desktop Computers