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  • 72V253L6BCG

72V253L6BCG

72V253 FIFO memory IC72V Series 72K 4K x 18 8K x 94ns


  • Manufacturer: Renesas Electronics America Inc.
  • Origchip NO: 668-72V253L6BCG
  • Package: 100-LBGA
  • Datasheet: PDF
  • Stock: 806
  • Description: 72V253 FIFO memory IC72V Series 72K 4K x 18 8K x 94ns (Kg)

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Details

Tags

Parameters
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 100-LBGA
Operating Temperature 0°C~70°C
Packaging Tray
Series 72V
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.15V~3.45V
Base Part Number 72V253
Function Synchronous
Current - Supply (Max) 35mA
Memory Size 72K 4K x 18 8K x 9
Access Time 4ns
Data Rate 166MHz
Bus Directional Uni-Directional
FWFT Support Yes
Expansion Type Depth, Width
RoHS Status ROHS3 Compliant

72V253L6BCG Overview


The 100-LBGA package contains FIFO memory chip.In the shape of a Tray , it's packaged.It is possible to store data and applications on the FIFO chips as they have 72K 4K x 18 8K x 9 in their memory.To ensure reliable operation, the temperature should be regulated to 0°C~70°C .It is mounted in the Surface Mount position.It uses a supply voltage of 3.15V~3.45V to operate.The 72V series includes this memory logic.As far as operating current is concerned, it has a maximum of 35mA .Memory IC belongs to the 72V253 family.

72V253L6BCG Features


72K 4K x 18 8K x 9 memory size
72V series
Best part number of 72V253

72V253L6BCG Applications


There are a lot of Renesas Electronics America Inc. 72V253L6BCG FIFOs Memory applications.

  • Event Recorder
  • Computers
  • Cardiac Monitoring Device
  • Seismic Data Collection at Extreme Temperatures
  • Consumer
  • Fabrication Site
  • Network switching/routing
  • Data-acquisition systems
  • SPI Bus Flash Memory Device
  • Down-Hole Energy Drilling