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  • 72V263L6BCG

72V263L6BCG

72V263 FIFO memory IC72V Series 144K 8K x 18 16K x 94ns


  • Manufacturer: Renesas Electronics America Inc.
  • Origchip NO: 668-72V263L6BCG
  • Package: 100-LBGA
  • Datasheet: PDF
  • Stock: 653
  • Description: 72V263 FIFO memory IC72V Series 144K 8K x 18 16K x 94ns (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 100-LBGA
Operating Temperature 0°C~70°C
Packaging Tray
Series 72V
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.15V~3.45V
Base Part Number 72V263
Function Synchronous
Current - Supply (Max) 35mA
Memory Size 144K 8K x 18 16K x 9
Access Time 4ns
Data Rate 166MHz
Bus Directional Uni-Directional
FWFT Support Yes
Expansion Type Depth, Width
RoHS Status ROHS3 Compliant

72V263L6BCG Overview


100-LBGA is the package in which FIFO memory chip is contained.This FIFO memory chip is packaged as a Tray .A FIFO chip's memory is 144K 8K x 18 16K x 9 , which may be used to store applications and data.A temperature regulation of 0°C~70°C is crucial for reliable operation.It is mounted in the Surface Mount position.A supply voltage of 3.15V~3.45V is required for its operation.It is a component from the 72V series.In this case, the FIFO's maximum supply current is 35mA .FIFO's FIFO's maximumMemory IC belongs to the 72V263 family.

72V263L6BCG Features


144K 8K x 18 16K x 9 memory size
72V series
Best part number of 72V263

72V263L6BCG Applications


There are a lot of Renesas Electronics America Inc. 72V263L6BCG FIFOs Memory applications.

  • General Data Collection Applications at Extreme High-Temperatures
  • Thermal Management for DDR3 Memory Modules
  • SPI Bus Flash Memory Device
  • Smart Meter
  • Data-acquisition systems
  • Switches
  • Extended product life cycle
  • Microprogramming
  • Computer Systems
  • A/D output buffers