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  • 72V36100L6BB8

72V36100L6BB8

3.3V 144 Pin FIFO memory IC4 ns Min 3.15V VMax 3.45V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V36100L6BB8
  • Package: BGA
  • Datasheet: PDF
  • Stock: 160
  • Description: 3.3V 144 Pin FIFO memory IC4 ns Min 3.15V VMax 3.45V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case BGA
Number of Pins 144
Packaging Tape & Reel
Published 2008
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 166MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.45V
Min Supply Voltage 3.15V
Element Configuration Dual
Nominal Supply Current 40mA
Max Supply Current 40mA
Frequency (Max) 166MHz
Access Time 4 ns
Direction Unidirectional
Density 2.3 Mb
Sync/Async Synchronous
Word Size 36b
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support Yes
Programmable Flags Support Yes
Length 13mm
Width 13mm
Thickness 1.76mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72V36100L6BB8 Overview


This package is included in BGA .There is a case Tape & Reel in which it is packaged.A Surface Mount mounting method is recommended.The operation pins are 144 pins.FIFO requires a minimum of 40mA current to operate.A supply voltage of 3.3V is recommended for FIFO's maximum efficiency.In order to ensure reliability, FIFO is maintained at 0°C degrees Celsius at all times.As a result of having a maximum operating temperature of 70°C degrees Celsius, the unit is capable of exhibiting stable operation.Low supply voltages, such as 3.15V V, may be required for operation.The memory logic's maximum supply voltage is 3.45V volts.Despite a frequency of 166MHz , it is capable of maintaining good accuracy.During normal operation, the FIFO memory's maximum value is 166MHz .

72V36100L6BB8 Features


Frequency at most

72V36100L6BB8 Applications


There are a lot of Integrated Device Technology (IDT) 72V36100L6BB8 FIFOs Memory applications.

  • Extended product-change notification
  • General Data Collection Applications at Low-Temperatures
  • Magnetic memories
  • Fabrication Site
  • Laser Receiver System
  • Extended product life cycle
  • Emulators
  • Computer networks
  • Application that requires re-writable nonvolatile parameter memory
  • Portable Information Devices