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  • 72V36100L7-5BB8

72V36100L7-5BB8

3.3V 144 Pin FIFO memory IC5 ns Min 3.15V VMax 3.45V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V36100L7-5BB8
  • Package: BGA
  • Datasheet: PDF
  • Stock: 989
  • Description: 3.3V 144 Pin FIFO memory IC5 ns Min 3.15V VMax 3.45V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case BGA
Number of Pins 144
Packaging Tape & Reel
Published 2003
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 133.3MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.45V
Min Supply Voltage 3.15V
Element Configuration Dual
Nominal Supply Current 40mA
Max Supply Current 40mA
Frequency (Max) 133.3MHz
Access Time 5 ns
Direction Unidirectional
Density 2.3 Mb
Sync/Async Synchronous
Word Size 36b
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support Yes
Programmable Flags Support Yes
Length 13mm
Width 13mm
Thickness 1.76mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72V36100L7-5BB8 Overview


This package is included in BGA .There's a Tape & Reel on the package.The recommended mounting way is Surface Mount .144 pins are the operation pins.In order to operate it, it requires 40mA volts of current.In order to maximize efficiency, the supply voltage should be set to 3.3V .It operates at 0°C degrees Celsius to ensure reliability.The stable operation is enabled by the memory logic's maximum operating temperature of 70°C °C.In some cases, FIFO operates at a very low supply voltage, such as 3.15V V.This FIFO memory chip can handle maximum supply voltages of 3.45V volts.Despite a frequency of 133.3MHz , it is capable of maintaining good accuracy.Regular operation has a FIFO memory's maximum value of 133.3MHz .

72V36100L7-5BB8 Features


Frequency at most

72V36100L7-5BB8 Applications


There are a lot of Integrated Device Technology (IDT) 72V36100L7-5BB8 FIFOs Memory applications.

  • Smart Meter
  • Portable Information Devices
  • Communications Systems
  • Seismic Data Collection at Extreme Temperatures
  • Measurement Equipment
  • General Data Collection Applications at Low-Temperatures
  • High-speed disk
  • High-speed graphics pixel buffer
  • Test Equipment
  • Wireless