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  • 72V3660L6BB

72V3660L6BB

3.3V 144 Pin FIFO memory IC4 ns Min 3.15V VMax 3.45V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V3660L6BB
  • Package: BGA
  • Datasheet: PDF
  • Stock: 768
  • Description: 3.3V 144 Pin FIFO memory IC4 ns Min 3.15V VMax 3.45V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case BGA
Number of Pins 144
Packaging Bulk
Published 2003
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 166MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.45V
Min Supply Voltage 3.15V
Element Configuration Dual
Nominal Supply Current 40mA
Max Supply Current 40mA
Frequency (Max) 166MHz
Access Time 4 ns
Density 144 kb
Sync/Async Synchronous
Word Size 36b
Bus Directional Unidirectional
Retransmit Capability Yes
Length 13mm
Width 13mm
Thickness 1.76mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72V3660L6BB Overview


The BGA package contains FIFO memory chip.In terms of packaging, it comes in Bulk cases.Surface Mount is recommended as the mounting method.There are 144 pins for operation.The maximum current required for its operation is 40mA .FIFO is recommended that the supply voltage be set to 3.3V for maximum efficiency.It is designed to run at a minimum temperature of 0°C degrees Celsius to ensure reliability.Keeping the operating temperature at 70°C °C allows the FIFO products to operate continuously.The FIFO memory chip may be operated at very low supply voltages, such as3.15V volts.FIFO memory is capable of handling a maximum supply voltage of 3.45V volts.It is capable of maintaining good accuracy with a frequency of 166MHz .Normally, the FIFO memory's maximum value is 166MHz .

72V3660L6BB Features


Frequency at most

72V3660L6BB Applications


There are a lot of Integrated Device Technology (IDT) 72V3660L6BB FIFOs Memory applications.

  • Portable Information Devices
  • High-speed graphics pixel buffer
  • Optical memories
  • Code converters
  • Switches
  • Temporary storage elements
  • Communications Systems
  • Network bridges
  • Wireless
  • Transistors