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72V3670L10PF

3.3V 128 Pin FIFO memory IC6.5 ns Min 3.15V VMax 3.45V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V3670L10PF
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 361
  • Description: 3.3V 128 Pin FIFO memory IC6.5 ns Min 3.15V VMax 3.45V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case TQFP
Number of Pins 128
Published 2008
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 100MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.45V
Min Supply Voltage 3.15V
Element Configuration Dual
Nominal Supply Current 40mA
Max Supply Current 40mA
Frequency (Max) 100MHz
Access Time 6.5 ns
Direction Unidirectional
Density 288 kb
Sync/Async Synchronous
Word Size 36b
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support Yes
Programmable Flags Support Yes
Length 20mm
Width 14mm
Thickness 1.4mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72V3670L10PF Overview


FIFO memory chip is contained in the TQFP package.Mounting it in the Surface Mount way is recommended.There are 128 pins for operation.FIFO design requires a maximum current of 40mA to operate.The supply voltage should be set to 3.3V in order to achieve FIFO's maximum efficiency.This FIFO products runs at 0°C degrees Celsius at a minimum temperature to ensure reliability.Its maximum operating temperature of 70°C °C ensures stable operation.FIFO may operate at a very low supply voltage, such as 3.15V V.FIFO memory is capable of handling a maximum supply voltage of 3.45V volts.A frequency of 100MHz is capable of maintaining good accuracy.During normal operation, the FIFO memory's maximum value is 100MHz .

72V3670L10PF Features


Frequency at most

72V3670L10PF Applications


There are a lot of Integrated Device Technology (IDT) 72V3670L10PF FIFOs Memory applications.

  • Queues for communication systems
  • Down-Hole Energy Drilling
  • Switches
  • Consumer Systems
  • SPD for DDR3 Memory Modules
  • Digital buffering
  • GPS Offender Tracking
  • Fabrication Site
  • Data communications
  • Extended product life cycle