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  • 72V3670L6PFG8

72V3670L6PFG8

72V3670 FIFO memory IC72V Series 288K 8K x 364ns


  • Manufacturer: Renesas Electronics America Inc.
  • Origchip NO: 668-72V3670L6PFG8
  • Package: 128-LQFP
  • Datasheet: PDF
  • Stock: 277
  • Description: 72V3670 FIFO memory IC72V Series 288K 8K x 364ns (Kg)

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Details

Tags

Parameters
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 128-LQFP
Supplier Device Package 128-TQFP (14x20)
Operating Temperature 0°C~70°C
Packaging Tape & Reel (TR)
Series 72V
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.15V~3.45V
Base Part Number 72V3670
Function Synchronous
Current - Supply (Max) 40mA
Memory Size 288K 8K x 36
Access Time 4ns
Data Rate 166MHz
Bus Directional Uni-Directional
Retransmit Capability Yes
FWFT Support Yes
Programmable Flags Support Yes
Expansion Type Depth, Width
RoHS Status ROHS3 Compliant

72V3670L6PFG8 Overview


The 128-LQFP package contains FIFO memory chip.Tape & Reel (TR) case is used for packaging.Data and applications can be stored in the FIFO chip's 288K 8K x 36 memory.To ensure reliable operation, the temperature should be regulated to 0°C~70°C .It is mounted in the Surface Mount position.Powered by a voltage of 3.15V~3.45V , it operates on a low supply voltage.A component in the 72V series, this is an memory logic.Memory IC's maximum operating supply current is 40mA .The 72V3670 family of objects contains it.

72V3670L6PFG8 Features


288K 8K x 36 memory size
72V series
Best part number of 72V3670

72V3670L6PFG8 Applications


There are a lot of Renesas Electronics America Inc. 72V3670L6PFG8 FIFOs Memory applications.

  • Disk Controllers
  • Switches
  • PC peripheral
  • Seismic Data Collection at Extreme Temperatures
  • Wireless
  • General Data Collection Applications at Extreme High-Temperatures
  • Down-Hole Energy Drilling
  • Notebook
  • Signal processing
  • Multi-stage synchronizer