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72V3670L7-5PFGI8

3.3V 128 Pin FIFO memory IC36kB5 ns Min 3V VMax 3.6V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V3670L7-5PFGI8
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 505
  • Description: 3.3V 128 Pin FIFO memory IC36kB5 ns Min 3V VMax 3.6V V(Kg)

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Details

Tags

Parameters
Weight 503.487531mg
Packaging Tape & Reel
Published 2014
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Operating Supply Voltage 3.3V
Number of Circuits 1
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Memory Size 36kB
Max Supply Current 40mA
Frequency (Max) 133.3MHz
Access Time 5 ns
Data Bus Width 36b
Direction Unidirectional
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support Yes
Programmable Flags Support Yes
RoHS Status RoHS Compliant
Factory Lead Time 7 Weeks
Contact Plating Tin
Mount Surface Mount
Package / Case TQFP
Number of Pins 128

72V3670L7-5PFGI8 Overview


You will find FIFO memory chip in the TQFP package.It's packaged in the shape of a Tape & Reel .There is a 36kB MB memory on the FIFO chips, which can be used to store both applications and data.Surface Mount is memory IC's recommended mounting method.As far as the operation pins are concerned, they are 128 pins.In order to operate FIFO design, a maximum current of 40mA is required.In order to maximize efficiency, the supply voltage should be set to 3.3V .In order to ensure reliability, FIFO is maintained at -40°C degrees Celsius at all times.A memory logic's maximum operating temperature of 85°C degrees Celsius assures stable operation.It is possible to operate the FIFO memory chip at very low supply voltages, such as 3V volts.A maximum voltage of 3.6V volts can be applied to FIFO memory.The memory logic's maximum value is 133.3MHz for regular operation.With 1 circuits, FIFO memory chip offers enhanced flexibility.

72V3670L7-5PFGI8 Features


36kB memory size
Frequency at most

72V3670L7-5PFGI8 Applications


There are a lot of Integrated Device Technology (IDT) 72V3670L7-5PFGI8 FIFOs Memory applications.

  • SPI Bus Flash Memory Devices
  • Controlled baseline
  • Communications Systems
  • Character generators
  • Event Recorder
  • High-speed disk
  • Data-acquisition systems
  • SPD for DDR3 Memory Modules
  • Portable Information Devices
  • Analog-to-digital converters