All Products

72V821L10TF

64 Terminations3.3V 64 Pin FIFO memory IC6.5 ns Min 3V VMax 3.6V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V821L10TF
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 814
  • Description: 64 Terminations3.3V 64 Pin FIFO memory IC6.5 ns Min 3V VMax 3.6V V(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case TQFP
Number of Pins 64
Published 2008
JESD-609 Code e0
Pbfree Code no
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3
Number of Terminations 64
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 64
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Nominal Supply Current 40mA
Max Supply Current 40mA
Frequency (Max) 100MHz
Access Time 6.5 ns
Organization 1KX9
Density 18 kb
Standby Current-Max 0.01A
Parallel/Serial PARALLEL
Sync/Async Synchronous
Word Size 9b
Memory IC Type OTHER FIFO
Bus Directional Bidirectional
FWFT Support No
Programmable Flags Support Yes
Output Enable YES
Cycle Time 10 ns
Height Seated (Max) 1.6mm
Length 10mm
Width 10mm
Thickness 1.4mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72V821L10TF Overview


TQFP is a package that contains FIFO memory chip.Mounting it Surface Mount is recommended.When the supply voltage is 3.3V , high efficiency is possible.64 terminations are contained in FIFO means.FIFO design has 64 operation pins.FIFO design requires a maximum current of 40mA to operate.FIFO is recommended that the supply voltage be set to 3.3V for maximum efficiency.It is designed to run at a minimum temperature of 0°C degrees Celsius to ensure reliability.Keeping the operating temperature at 70°C °C allows the FIFO products to operate continuously.It is self-contained in FIFOs .ICs of type OTHER FIFO are used in the FIFO memory chip.Typically, FIFO would work at 3V volts, but it may also work at higher voltages.FIFO memory is capable of handling a maximum supply voltage of 3.6V volts.There are a total of 64 pins on this board.When the frequency is set to 100MHz it can maintain good accuracy.During regular operation, 100MHz is the FIFO memory's maximum value.

72V821L10TF Features


FIFOs category
Frequency at most

72V821L10TF Applications


There are a lot of Integrated Device Technology (IDT) 72V821L10TF FIFOs Memory applications.

  • Video
  • SPD for DDR3 Memory Modules
  • Computer networks
  • Address mapping
  • Consumer Systems
  • Test site
  • SPI Bus Flash Memory Devices
  • Optical memories
  • Controlled baseline
  • Wireless