All Products

72V841L15TFGI8

64 Terminations3.3V 64 Pin FIFO memory IC10 ns


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V841L15TFGI8
  • Package: LQFP
  • Datasheet: PDF
  • Stock: 700
  • Description: 64 Terminations3.3V 64 Pin FIFO memory IC10 ns (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Mount Surface Mount
Package / Case LQFP
Number of Pins 64
Packaging Tape & Reel
Published 2008
JESD-609 Code e3
Pbfree Code yes
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3
Number of Terminations 64
ECCN Code EAR99
Terminal Finish Matte Tin (Sn) - annealed
Max Operating Temperature 85°C
Min Operating Temperature -40°C
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 64
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 3V
Max Supply Current 40mA
Frequency (Max) 66.7MHz
Access Time 10 ns
Data Bus Width 9b
Organization 4KX9
Density 72 kb
Standby Current-Max 0.01A
Parallel/Serial PARALLEL
Memory IC Type BI-DIRECTIONAL FIFO
Bus Directional Bidirectional
Programmable Flags Support Yes
Output Enable YES
Cycle Time 15 ns
Height Seated (Max) 1.6mm
Length 10mm
Width 10mm
Thickness 1.4mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

72V841L15TFGI8 Overview


You can find FIFO memory chip in package LQFP .There's a Tape & Reel on the package.Mounting it in Surface Mount is recommended.It is possible to achieve high efficiency with a supply voltage of 3.3V .64 terminations are contained in FIFO means.These are the 64 pins for operation.Its maximum operating current is 40mA .A supply voltage of 3.3V is recommended for FIFO's maximum efficiency.FIFO operates at a minimum temperature of -40°C degrees Celsius to ensure reliabilFIFOy.By using a memory logic's maximum operating temperature of 85°C degrees Celsius, stable operation can be achieved.FIFOs contains this gadget in its entirety.In this part, the memory type is BI-DIRECTIONAL FIFO .As a result, it contains a total of 64 pins.The memory logic's maximum value is 66.7MHz for regular operation.There is a FIFO memory IC's maximum supply voltage of 3.6V (Vsup).In order to ensure normal operation, the supply voltage (Vsup) should be kept above 3V .

72V841L15TFGI8 Features


FIFOs category
Frequency at most

72V841L15TFGI8 Applications


There are a lot of Integrated Device Technology (IDT) 72V841L15TFGI8 FIFOs Memory applications.

  • Test Equipment
  • Game Consoles
  • Portable Information Devices
  • Digital buffering
  • Thermal Management for DDR3 Memory Modules
  • Network bridges
  • Down-Hole Energy Drilling
  • High-speed graphics pixel buffer
  • Computer Systems
  • Microprogramming