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  • 74ALVCF162835APFG8

74ALVCF162835APFG8

74ALVCF162835APFG8 datasheet pdf and Logic - Universal Bus Functions product details from Integrated Device Technology (IDT) stock available at Utmel


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-74ALVCF162835APFG8
  • Package: TFSOP
  • Datasheet: PDF
  • Stock: 314
  • Description: 74ALVCF162835APFG8 datasheet pdf and Logic - Universal Bus Functions product details from Integrated Device Technology (IDT) stock available at Utmel(Kg)

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Details

Tags

Parameters
Mount Surface Mount
Package / Case TFSOP
Number of Pins 56
Packaging Tape & Reel (TR)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Direction Unidirectional
High Level Output Current 18mA
Low Level Output Current 18mA
Length 11.3mm
Width 4.4mm
Thickness 1mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

74ALVCF162835APFG8 Overview


A copy of it is embedded in the package TFSOP. In this case, it is packaged in the same way as Tape & Reel (TR). In this case, the electronic part will be mounted in the Surface Mount-direction. The 56 pins are designed to be a part of it. A high level output current is defined as 18mA. As far as the operating temperature is concerned, it should be higher than -40°C. The operating temperature should be lower than 85°C.

74ALVCF162835APFG8 Features


TFSOP package
56 pins

74ALVCF162835APFG8 Applications


There are a lot of Integrated Device Technology (IDT) 74ALVCF162835APFG8 Universal Bus Functions applications.

  • Mountain power station
  • Electric car
  • Microprocessors
  • Grid adaptation function
  • Photovoltaic grid-connected power system
  • automatic temperature control circuits
  • Overcurrent/Short circuit protection
  • Automatic digital control circuits
  • Server
  • Residual current/leakage current protection