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  • 74F413PC

74F413PC

16 TerminationsFIFO memory IC74F Series 256 64 x 4


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-74F413PC
  • Package: 16-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 880
  • Description: 16 TerminationsFIFO memory IC74F Series 256 64 x 4(Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 16-DIP (0.300, 7.62mm)
Surface Mount NO
Operating Temperature 0°C~70°C
Packaging Tube
Series 74F
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 16
ECCN Code EAR99
Terminal Finish TIN LEAD
HTS Code 8542.32.00.71
Technology CMOS
Voltage - Supply 4.5V~5.5V
Terminal Position DUAL
Supply Voltage 5V
JESD-30 Code R-PDIP-T16
Function Asynchronous
Current - Supply (Max) 160mA
Supply Voltage-Max (Vsup) 5.25V
Supply Voltage-Min (Vsup) 4.75V
Memory Size 256 64 x 4
Data Rate 10MHz
Organization 64X4
Memory Width 4
Memory Density 256 bit
Access Time (Max) 55 ns
Parallel/Serial PARALLEL
Bus Directional Uni-Directional
FWFT Support No
Output Enable NO
Expansion Type Depth, Width
Cycle Time 100 ns
RoHS Status Non-RoHS Compliant

74F413PC Overview


16-DIP (0.300, 7.62mm) is the package in which FIFO memory chip is contained.In terms of packaging, it comes in Tube cases.In addition, the FIFO chip has a memory capacity of 256 64 x 4 , which can be used to store applications and data.A temperature regulation of 0°C~70°C is crucial for reliable operation.There is a mounting type of Through Hole on the FIFO memory.For operation, it requires a supply voltage of 4.5V~5.5V .It is a member of the 74F series .A FIFO's maximum operating supply current of 160mA is available.When the supply voltage is 5V there is the possibility of high efficiency.In FIFO means, there are 16 terminations.Voltage FIFO memory IC's maximum is set to 5.25V .A voltage above 4.75V is necessary for normal operation.

74F413PC Features


256 64 x 4 memory size
74F series

74F413PC Applications


There are a lot of Rochester Electronics, LLC 74F413PC FIFOs Memory applications.

  • Magnetic memories
  • Data-acquisition systems
  • Thermal Management for DDR3 Memory Modules
  • Networking
  • Video
  • Rate buffers
  • Industrial Systems
  • Communications
  • Portable Information Devices
  • Measurement Equipment