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82P2821BHG

IDT82P2821 Telecom device1 Circuits


  • Manufacturer: Renesas Electronics America Inc.
  • Origchip NO: 668-82P2821BHG
  • Package: 640-BGA Exposed Pad
  • Datasheet: PDF
  • Stock: 901
  • Description: IDT82P2821 Telecom device1 Circuits(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 640-BGA Exposed Pad
Supplier Device Package 640-TEPBGA (31x31)
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.8V 3.3V
Base Part Number IDT82P2821
Function Line Interface Unit (LIU)
Interface E1, J1, T1
Number of Circuits 1
RoHS Status ROHS3 Compliant

82P2821BHG Overview


Saving board space is achieved with the 640-BGA Exposed Pad package.A Tray-packing method is used to pack telecommunications equipment.Telecommunications equipment is mounted using Surface Mount.1 circuits make up this telecom IC .The voltage supplied to 1.8V 3.3V can improve efficiency.-40°C~85°C is the operating temperature that can be set for reliable performance.IDT82P2821 is the base part number, which can be used to find more related parts.

82P2821BHG Features


Available in the 640-BGA Exposed Pad package

82P2821BHG Applications


There are a lot of Renesas Electronics America Inc. 82P2821BHG Telecom applications.

  • Central office
  • Digital Cross-Connect Systems
  • Fiber Optic Terminals
  • CSU/DSU E1 Interface
  • Integrated Multi-Service Access Platforms (IMAPs)
  • Cable Modem
  • ISDN Primary Rate Interface
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • Channel Banks
  • NIU