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92HD91B1X5NLGXYAX8

92HD91B1X5NLGXYAX8 datasheet pdf and Interface - CODECs product details from Integrated Device Technology (IDT) stock available at Utmel


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-92HD91B1X5NLGXYAX8
  • Package: QFN
  • Datasheet: PDF
  • Stock: 464
  • Description: 92HD91B1X5NLGXYAX8 datasheet pdf and Interface - CODECs product details from Integrated Device Technology (IDT) stock available at Utmel(Kg)

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Details

Tags

Parameters
Terminal Pitch 0.5mm
Operating Temperature (Max) 70°C
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 4.75V
Sampling Rate 192 ksps
Number of A/D Converters 2
Consumer IC Type CONSUMER CIRCUIT
Height Seated (Max) 1mm
Length 7mm
Width 7mm
Thickness 900μm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Package / Case QFN
Surface Mount YES
Number of Pins 48
Packaging Tape & Reel
JESD-609 Code e3
Moisture Sensitivity Level (MSL) 3
Number of Terminations 48
Terminal Finish Matte Tin (Sn) - annealed
Additional Feature ALSO REQUIRES 3.135 TO 3.465 V
Terminal Position QUAD
Number of Functions 1

92HD91B1X5NLGXYAX8 Overview


A QFN package is provided to save space. Tape & Reel packaging method is used. In order to prevent signal reflections from off the end of the transmission line, 48 terminations are used. This device consists of a row of 48-pins. As a result of analog signals being converted into digital signals, there are 2 A/D converters. 4.75V is the minimum voltage it supports. A maximum operating temperature of 70°C should not be exceeded. A consumer IC of type CONSUMER CIRCUIT is used in it. It is characterized by ALSO REQUIRES 3.135 TO 3.465 V.

92HD91B1X5NLGXYAX8 Features


Embedded in the QFN package
2 A/D converters
ALSO REQUIRES 3.135 TO 3.465 V

92HD91B1X5NLGXYAX8 Applications


There are a lot of Integrated Device Technology (IDT) 92HD91B1X5NLGXYAX8 CODECs Interface ICs applications.

  • Linear measurement
  • Microprocessor
  • Image compression
  • Flight simulators
  • Packaging
  • Counting applications
  • Conveying
  • Wire number reduction in application that have multiple inputs
  • CPU memory location identification
  • Robotic arm positioning