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A2F060M3E-1FG256I

256 Terminations-40°C~100°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F060M3E-1FG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 532
  • Description: 256 Terminations-40°C~100°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O1.5V (Kg)

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Details

Tags

Parameters
Package / Case 256-LBGA
Surface Mount YES
Number of Pins 256
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series SmartFusion®
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F060M3E
Number of Outputs 66
Operating Supply Voltage 1.5V
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 26, FPGA - 66
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Logic Blocks (LABs) 8
Speed Grade 1
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Number of Registers 1536
Number of Equivalent Gates 60000
Flash Size 128KB
Radiation Hardening No
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 16KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.The system on a chip is part of the series SmartFusion?.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.It is important to note that this SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 26, FPGA - 66 I/Os are included in this SoC part.Use a power supply with a voltage of 1.5V if possible.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.As a result, there are 256 terminations in total, which does really benefit system on a chip.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 66 outputs.A flashing 128KB appears on it.Search A2F060M3E for system on chips with similar specs and purposes.100MHz is the wireless SoC's frequency.This SoC meaning utilizes a core architecture of ARM as its foundation.256 pins are present on this computer SoC.

ARM? Cortex?-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

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