A2F060M3E-FG256I

This SoC is built on ARM? Cortex?-M3 core processor(s).

Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.It has been assigned a package 256-LBGA by its manufacturer for this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 16KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the SmartFusion? series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 26, FPGA - 66 I/Os are included in this SoC part.The flash is set to 128KB.A search for A2F060M3E will result in system on chips that have similar specs and purposes.The wireless SoC works at a frequency of 80MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.256 pins are present on this computer SoC.In order for the SoC computing to start, -40°C is just about right.This SoC system on chip is designed to operate at a temperature of 100°C.The maximum supply voltage is rated as 1.575V.A minimum of 1.425V power is supplied to it.

ARM? Cortex?-M3 processor.

16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

A2F060M3E-FG256I System On Chip (SoC) applications.

• Efficient hardware for training of neural networks
• Networked sensors
• Personal Computers
• Industrial automation devices
• Efficient hardware for inference of neural networks
• Fitness
• Central inverter
• POS Terminals
• Vending machines
• Central alarm system