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A2F060M3E-FGG256

256 Terminations0°C~85°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O1.5V Min 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F060M3E-FGG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 987
  • Description: 256 Terminations0°C~85°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O1.5V Min 1.425V VMax 1.575V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 2 Weeks
Mount Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F060M3E
Operating Supply Voltage 1.5V
Interface EBI/EMI, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 4.5kB
Operating Supply Current 3mA
Number of I/O MCU - 26, FPGA - 66
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 660
Core Architecture ARM
Number of Gates 60000
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB
Height Seated (Max) 1.7mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


On this SoC, there is ARM? Cortex?-M3 core processor.Manufacturer assigns package 256-LBGA to this system on a chip.With 16KB RAM implemented, this SoC chip provides reliable operation.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series in which this system on chip SoC falls under.The average operating temps for this SoC meaning should be 0°C~85°C TJ.A key point to note is that this SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops.It comes in a state-of-the-art Tray package.An integral part of this SoC consists of a total of MCU - 26, FPGA - 66 I/Os.A power supply with a 1.5V rating is recommended.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.In total, there are 256 terminations, which is great for system on a chip.This flash has a size of 128KB.By searching A2F060M3E, you will find system on chips with similar specs and purposes.A frequency of 80MHz is used by the wireless SoC to operate.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 256.It is rated with 1.575V maximum supply voltage.The SoC security receives at least 1.425V watts of power.

ARM? Cortex?-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F060M3E-FGG256 System On Chip (SoC) applications.

  • Vending machines
  • Digital Signal Processing
  • Transmitters
  • Keyboard
  • Industrial automation devices
  • Temperature Sensors
  • Vending machines
  • Servo drive control module
  • Digital Media
  • Central alarm system