A2F060M3E-FGG256I

This SoC is built on ARM? Cortex?-M3 core processor(s).

On this SoC, there is ARM? Cortex?-M3 core processor.Manufacturer assigns package 256-LBGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 16KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops, an important feature to keep in mind.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part contains a total of MCU - 26, FPGA - 66 I/Os in total.This flash has a size of 128KB.By searching A2F060M3E, you will find system on chips with similar specs and purposes.The wireless SoC works at a frequency of 80MHz.Based on the core architecture of ARM, the SoC meaning has a high level of performance.There is a 256-pin version of this computer SoC available.Just -40°C will start the SoC computing.There is a design maximum operating temperature of 100°C for this SoC system on chip.Supply voltage is rated at 1.575V.As long as it receives at least 1.425V of power, then it is working.

ARM? Cortex?-M3 processor.

16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

A2F060M3E-FGG256I System On Chip (SoC) applications.

• Sensor network-on-chip (sNoC)
• Healthcare
• Mouse
• POS Terminals
• Avionics
• Self-aware system-on-chip (SoC)
• Smartphones
• Test and Measurement
• Wireless networking
• Industrial Pressure