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A2F060M3E-TQ144I

-40°C~100°C TJ A2F060M3E System On ChipSmartFusion? Series MCU - 21, FPGA - 33 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F060M3E-TQ144I
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: 520
  • Description: -40°C~100°C TJ A2F060M3E System On ChipSmartFusion? Series MCU - 21, FPGA - 33 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 80MHz
Base Part Number A2F060M3E
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 21, FPGA - 33
Speed 80MHz
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.The manufacturer assigns this system on a chip with a 144-LQFP package.The 16KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.A system on chip SoC of this type belongs to the SmartFusion? series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops.An advanced Tray package houses this SoC system on a chip.This SoC part has a total of MCU - 21, FPGA - 33 I/Os.There is a flash of 128KB on it.Search A2F060M3E for system on chips with similar specs and purposes.80MHz is the wireless SoC's frequency.In terms of core architecture, the SoC meaning relies on ARM.Just -40°C will start the SoC computing.This SoC system on chip operates at a maximum design temperature of 100°C.

ARM? Cortex?-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

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A2F060M3E-TQ144I System On Chip (SoC) applications.

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