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A2F060M3E-TQG144I

-40°C~100°C TJ A2F060M3E System On ChipSmartFusion? Series MCU - 21, FPGA - 33 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F060M3E-TQG144I
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: 801
  • Description: -40°C~100°C TJ A2F060M3E System On ChipSmartFusion? Series MCU - 21, FPGA - 33 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2011
Series SmartFusion®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 80MHz
Base Part Number A2F060M3E
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 21, FPGA - 33
Speed 80MHz
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).The manufacturer assigns this system on a chip with a 144-LQFP package.The SoC chip provides users with reliable performance because it is implemented with 16KB RAM.Internally, this SoC design uses the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops and that is something to note.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are MCU - 21, FPGA - 33.The flash size of the SoC meaning is 128KB.Searching A2F060M3E will yield system on chips with similar specs and purposes.There is 80MHz frequency associated with the wireless SoC.In terms of core architecture, the SoC meaning relies on ARM.In order for the SoC computing to start up, -40°C is sufficient.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 100°C.

ARM? Cortex?-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F060M3E-TQG144I System On Chip (SoC) applications.

  • Industrial transport
  • POS Terminals
  • Robotics
  • Medical
  • Efficient hardware for inference of neural networks
  • Healthcare
  • Apple smart watch
  • Defense
  • sequence controllers
  • Transmitters