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A2F200M3F-1FG256I

256 Terminations-40°C~100°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F200M3F-1FG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 827
  • Description: 256 Terminations-40°C~100°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Surface Mount YES
Number of Pins 256
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series SmartFusion®
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F200
Number of Outputs 66
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Operating Supply Current 3mA
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 200000
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
Height Seated (Max) 1.7mm
Length 17mm
Width 17mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion? is the series in which this system on chip SoC falls under.The average operating temps for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.Total I/Os on this SoC part are MCU - 25, FPGA - 66.A 1.5V power supply should be used.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.575V.In order to run it, it must be fed by at least 1.425V of power.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.In total, there are 256 terminations, which is great for system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 66 outputs, which is convenient.It has a 256KB flash.A2F200 can help you find system on chips with similar specs and purposes.A frequency of 100MHz is used by the wireless SoC to operate.Core architecture of ARM underpins the SoC meaning.The computer SoC is the 256-pin version.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-1FG256I System On Chip (SoC) applications.

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