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A2F200M3F-1FGG256I

-40°C~100°C TJ A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F200M3F-1FGG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 202
  • Description: -40°C~100°C TJ A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
RoHS Status RoHS Compliant
Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number A2F200
Number of I/O MCU - 25, FPGA - 66
Speed 100MHz

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).According to the manufacturer, this system on a chip has a package of 256-LBGA.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 25, FPGA - 66 I/Os are available in this SoC part.There is a flash of 256KB on it.Search A2F200 for system on chips with similar specs and purposes.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


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