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Part Number
Manufacturers
Desc
In Stock
Packing
Rfq
Microsemi Corporation
484 Terminations0°C~85°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/O1.5V
549
484-BGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
843
325-TFBGA, CSPBGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
941
325-TFBGA, CSPBGA
Microsemi Corporation
-40°C~100°C TJ M2S010TS System On ChipSmartFusion?2 Series 233 I/O
277
484-BGA
Microsemi Corporation
-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O
150
256-LBGA
Microsemi Corporation
484 Terminations0°C~85°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/O1.5V Min 1.425V VMax 1.575V V
364
484-BGA
Xilinx Inc.
225 Terminations0°C~100°C TJ System On ChipZynq?-7000 Series 54 I/O1V
565
225-LFBGA, CSPBGA
Microsemi Corporation
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
367
256-LBGA
Microsemi Corporation
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
799
256-LFBGA
Microsemi Corporation
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
297
400-LFBGA
Microsemi Corporation
0°C~85°C TJ 400 Pin M2S025T System On ChipSmartFusion?2 Series 207 I/O
257
400-LFBGA
Microsemi Corporation
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
295
256-LBGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
242
325-TFBGA, CSPBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/O1.5V Min 1.425V VMax 1.575V V
192
484-BGA
Microsemi Corporation
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
905
400-LFBGA
Microsemi Corporation
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
168
256-LFBGA
Microsemi Corporation
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
453
256-LFBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O1.5V Min 1.425V VMax 1.575V V
243
484-BGA
Xilinx Inc.
225 Terminations-40°C~125°C TJ 225 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 86 I/O
929
225-LFBGA, CSPBGA
Microsemi Corporation
0°C~85°C TJ M2S025 System On ChipSmartFusion?2 Series 267 I/O
695
484-BGA
Microsemi Corporation
0°C~85°C TJ 400 Pin M2S025 System On ChipSmartFusion?2 Series 207 I/O
922
400-LFBGA
Microsemi Corporation
0°C~85°C TJ M2S025 System On ChipSmartFusion?2 Series 267 I/O
125
484-BGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
498
325-TFBGA, CSPBGA
Microsemi Corporation
-40°C~100°C TJ 400 Pin M2S025 System On ChipSmartFusion?2 Series 207 I/O
478
400-LFBGA
Xilinx Inc.
400 Terminations-40°C~100°C TJ 400 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O
796
400-LFBGA, CSPBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O1.5V Min 1.425V VMax 1.575V V
750
484-BGA
Xilinx Inc.
225 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 86 I/O1V
790
225-LFBGA, CSPBGA
Microsemi Corporation
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
755
256-LBGA
Microsemi Corporation
0°C~85°C TJ 288 Pin A2F200 System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/OMin 1.425V VMax 1.575V V
480
288-TFBGA, CSPBGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
937
325-TFBGA, CSPBGA