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A2F200M3F-1FGG484I

484 Terminations-40°C~100°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/O1.5V Min 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F200M3F-1FGG484I
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 192
  • Description: 484 Terminations-40°C~100°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/O1.5V Min 1.425V VMax 1.575V V(Kg)

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Details

Tags

Parameters
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F200
Number of Outputs 94
Qualification Status Not Qualified
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Operating Supply Current 1mA
Number of I/O MCU - 41, FPGA - 94
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 200000
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant
Factory Lead Time 12 Weeks
Package / Case 484-BGA
Surface Mount YES
Number of Pins 484
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.5V
Terminal Pitch 1mm

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.This system on a chip is packaged as 484-BGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion? is the series in which this system on chip SoC falls under.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part is comprised of MCU - 41, FPGA - 94 inputs and outputs.Ideally, a power supply with a voltage of 1.5V should be used.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.As a result, there are 484 terminations in total, which does really benefit system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.There are 94 outputs available on this SoC.It has a 256KB flash.By searching A2F200, you will find system on chips with similar specs and purposes.The wireless SoC works at a frequency of 100MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC is the 484-pin version.Voltages up to 1.575V are specified for this SoC security.Power is supplied to it at least in the amount of 1.425V.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-1FGG484I System On Chip (SoC) applications.

  • Smartphone accessories
  • Level
  • Sensor network-on-chip (sNoC)
  • Keywords
  • AC drive control module
  • Industrial automation devices
  • Fitness
  • Self-aware system-on-chip (SoC)
  • Smartphones
  • Avionics