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A2F200M3F-FG484

484 Terminations0°C~85°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F200M3F-FG484
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 549
  • Description: 484 Terminations0°C~85°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/O1.5V (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 484-BGA
Surface Mount YES
Number of Pins 484
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F200
Number of Outputs 94
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Operating Supply Current 2mA
Number of I/O MCU - 41, FPGA - 94
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 200000
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is a member of the SmartFusion? series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.A key point to note is that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part includes MCU - 41, FPGA - 94 I/Os.A 1.5V power supply is recommended.In the SoCs wireless, voltages above 1.575V are considered unsafe.It can feed on a power supply of at least 1.425V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.In total, there are 484 terminations, which is great for system on a chip.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.A SoC chip with 94 outputs is available.As for its flash size, it is 256KB.A search for A2F200 will result in system on chips that have similar specs and purposes.A wireless SoC that operates at a frequency of 80MHz is what the wireless SoC does.The SoC meaning is based on the core architecture of ARM.The computer SoC has 484 pins.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-FG484 System On Chip (SoC) applications.

  • Automotive
  • Personal Computers
  • AC drive control module
  • Cyber security for critical applications in the aerospace
  • Apple smart watch
  • Multiprocessor system-on-chips (MPSoCs)
  • Level
  • RISC-V
  • Industrial automation devices
  • Communication interfaces ( I2C, SPI )