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A2F200M3F-FGG484

484 Terminations0°C~85°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/O1.5V Min 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F200M3F-FGG484
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 364
  • Description: 484 Terminations0°C~85°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/O1.5V Min 1.425V VMax 1.575V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 2 Weeks
Package / Case 484-BGA
Surface Mount YES
Number of Pins 484
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2011
Series SmartFusion®
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number A2F200
Number of Outputs 94
Qualification Status Not Qualified
Operating Supply Voltage 1.5V
Power Supplies 1.51.82.53.3V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 4.5kB
Operating Supply Current 7mA
Number of I/O MCU - 41, FPGA - 94
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 2500
Core Architecture ARM
Number of Gates 200000
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant
Lead Free Lead Free

This SoC is built on ARM? Cortex?-M3 core processor(s).


A ARM? Cortex?-M3 core processor(s) is built into this SoC.This system on a chip is packaged as 484-BGA by the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.This SoC design employs the MCU, FPGA technique for its internal architecture.A system on chip SoC of this type belongs to the SmartFusion? series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.A key point to note is that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of MCU - 41, FPGA - 94 I/Os.For safe operation, it is advisable to utilize a power supply with 1.5V voltage.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.It is really beneficial to have system on a chip since there are 484 terminations in total.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.This SoC chip is capable of having 94 outputs, which is convenient.This system on chip SoC requires 1.51.82.53.3V power supply at all.A 256KB flash can be seen on it.Search A2F200 for system on chips with similar specs and purposes.80MHz is the wireless SoC's frequency.In this SoC meaning, ARM serves as the core architecture.This is the version with 484 pins.This power supply is rated with a maximum voltage of 1.575V.At least 1.425V power is delivered to it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-FGG484 System On Chip (SoC) applications.

  • Automated sorting equipment
  • Cyber security for critical applications in the aerospace
  • Test and Measurement
  • Mobile market
  • Central alarm system
  • Functional safety for critical applications in the aerospace
  • Temperature
  • Functional safety for critical applications in the industrial sectors
  • AC drive control module
  • System-on-chip (SoC)