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A2F200M3F-PQ208I

208 Terminations-40°C~100°C TJ 208 Pin A2F200 System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F200M3F-PQ208I
  • Package: 208-BFQFP
  • Datasheet: PDF
  • Stock: 902
  • Description: 208 Terminations-40°C~100°C TJ 208 Pin A2F200 System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/O1.5V (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 208-BFQFP
Surface Mount YES
Number of Pins 208
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
Terminal Finish Tin/Lead (Sn/Pb)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 0.5mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F200
Number of Outputs 66
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 22, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Equivalent Gates 200000
Flash Size 256KB
Height Seated (Max) 4.1mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Manufacturer assigns package 208-BFQFP to this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.A system on chip SoC of this type belongs to the SmartFusion? series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.There is a state-of-the-art Tray package that houses this SoC system on a chip.In total, this SoC part has MCU - 22, FPGA - 66 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.For the SoCs wireless, a voltage higher than 1.575V is considered unsafe.As a minimum, the power supply of the SoC system on a chip needs to be 1.425V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 208 terminations, which is great for system on a chip.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.In order for this SoC chip to work properly, you can have 66 outputs.There is a flash of 256KB on it.Searching A2F200 will yield system on chips with similar specs and purposes.The wireless SoC works at a frequency of 80MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.This is the version with 208 pins.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

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