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A2F500M3G-1FG484I

484 Terminations-40°C~100°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O1.5V Min 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F500M3G-1FG484I
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 243
  • Description: 484 Terminations-40°C~100°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O1.5V Min 1.425V VMax 1.575V V(Kg)

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Details

Tags

Parameters
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F500M3G
Number of Outputs 128
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Operating Supply Current 1mA
Number of I/O MCU - 41, FPGA - 128
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 500000
Number of Logic Blocks (LABs) 24
Speed Grade 1
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Registers 11520
Flash Size 512KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
Factory Lead Time 12 Weeks
Mount Surface Mount
Package / Case 484-BGA
Number of Pins 484
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Frequency 100MHz

This SoC is built on ARM? Cortex?-M3 core processor(s).


A ARM? Cortex?-M3 core processor(s) is built into this SoC.According to the manufacturer, this system on a chip has a package of 484-BGA.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.This SoC design employs the MCU, FPGA technique for its internal architecture.Featured system on chip SoCs of the SmartFusion? series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 41, FPGA - 128 inputs and outputs.It is recommended to use a 1.5V power supply.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.Having 484 terminations in total makes system on a chip possible.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.This SoC chip is capable of having 128 outputs, which is convenient.There is a flash of 512KB.Search A2F500M3G for system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 100MHz.In this SoC meaning, ARM serves as the core architecture.The computer SoC has a pin count of 484.It is rated with 1.575V maximum supply voltage.Power is provided to it at least to the extent that 1.425V is required.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-1FG484I System On Chip (SoC) applications.

  • Defense
  • Industrial automation devices
  • Deep learning hardware
  • PC peripherals
  • Smartphones
  • Functional safety for critical applications in the industrial sectors
  • Communication interfaces ( I2C, SPI )
  • External USB hard disk/SSD
  • Avionics
  • Microcontroller based SoC ( RISC-V, ARM)