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A2F500M3G-1FGG256

0°C~85°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F500M3G-1FGG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 617
  • Description: 0°C~85°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V(Kg)

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Details

Tags

Parameters
Mount Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 100MHz
Base Part Number A2F500M3G
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 13.5kB
Operating Supply Current 16.5mA
Number of I/O MCU - 25, FPGA - 66
Speed 100MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 5500
Core Architecture ARM
Number of Gates 500000
Max Frequency 120MHz
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Assigned with the package 256-LBGA, this system on a chip comes from the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.Internally, this SoC design uses the MCU, FPGA technique.In the SmartFusion? series, this system on chip SoC is included.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.There is one thing to note about this SoC security: it combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 25, FPGA - 66 I/Os are available in this SoC part.There is a flash of 512KB.By searching A2F500M3G, you will find system on chips with similar specs and purposes.wireless SoCs operate at 100MHz.In this SoC meaning, ARM serves as the core architecture.Currently, the computer SoC is available in a 256-pin version.0°C is just enough for the SoC computing to start up.There is a maximum operating temperature of 85°C set for this SoC system on chip during its design.This power supply is rated with a maximum voltage of 1.575V.The SoC security is powered at least by 1.425V.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-1FGG256 System On Chip (SoC) applications.

  • Embedded systems
  • Sports
  • Industrial robot
  • Functional safety for critical applications in the automotive
  • Deep learning hardware
  • Transmitters
  • ARM
  • Self-aware system-on-chip (SoC)
  • Industrial sectors
  • Wireless networking