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A2F500M3G-1FGG256I

256 Terminations-40°C~100°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F500M3G-1FGG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 437
  • Description: 256 Terminations-40°C~100°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V (Kg)

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Details

Tags

Parameters
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 500000
Number of Logic Blocks (LABs) 24
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
Height Seated (Max) 1.7mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant
Lead Free Lead Free
Package / Case 256-LBGA
Surface Mount YES
Number of Pins 256
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2013
Series SmartFusion®
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F500M3G
Number of Outputs 66
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Power Supplies 1.51.82.53.3V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 256-LBGA by the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.Internally, this SoC design uses the MCU, FPGA technique.SmartFusion? is the series number of this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.This SoC system on a chip has been designed in a state-of-the-art Tray package.An integral part of this SoC consists of a total of MCU - 25, FPGA - 66 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.An excessive voltage of 1.575V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.This SoC system on a chip can run on a power supply that is at least 1.425V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 256 terminations, which is great for system on a chip.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.There is the option to have 66 outputs on this SoC chip.There is 1.51.82.53.3V power supply requirement for this system on chip SoC.The flash is set to 512KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F500M3G.wireless SoCs operate at 100MHz.In this SoC meaning, ARM serves as the core architecture.This is the version with 256 pins.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


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