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A2F500M3G-FG256I

256 Terminations-40°C~100°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F500M3G-FG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 809
  • Description: 256 Terminations-40°C~100°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V (Kg)

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Details

Tags

Parameters
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Power Supplies 1.51.82.53.3V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Operating Supply Current 2mA
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 500000
Number of Logic Blocks (LABs) 24
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
Height Seated (Max) 1.7mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Surface Mount YES
Number of Pins 256
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F500M3G
Number of Outputs 66

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.It has been assigned a package 256-LBGA by its manufacturer for this system on a chip.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.It is a member of the SmartFusion? series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.In the state-of-the-art Tray package, this SoC system on a chip is housed.MCU - 25, FPGA - 66 I/Os in total are included in this SoC part.Ideally, a power supply with a voltage of 1.5V should be used.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.575V.There is a possibility that it can be powered by a power supply of at least 1.425V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.In total, there are 256 terminations, which makes system on a chip possible.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.A SoC chip like this can have 66 outputs.There is 1.51.82.53.3V power supply required for system on chip.There is a flash of 512KB on it.It is possible to find system on chips that are similar in specs and purpose by searching for A2F500M3G.During operation, the wireless SoC runs at a frequency of 80MHz.In this SoC meaning, ARM serves as the core architecture.The computer SoC has a pin count of 256.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-FG256I System On Chip (SoC) applications.

  • Samsung galaxy gear
  • Avionics
  • Automotive gateway
  • Communication interfaces ( I2C, SPI )
  • RISC-V
  • Automated sorting equipment
  • Mouse
  • ARM
  • Published Paper
  • Special Issue Editors