All Products

A2F500M3G-FGG484M

-55°C~125°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F500M3G-FGG484M
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 100
  • Description: -55°C~125°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 484-BGA
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Frequency 80MHz
Base Part Number A2F500M3G
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 41, FPGA - 128
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.The SmartFusion? series contains this system on chip SoC.It is recommended that this SoC meaning be operated at -55°C~125°C TJ on an average.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops, an important feature to keep in mind.There is a state-of-the-art Tray package that houses this SoC system on a chip.MCU - 41, FPGA - 128 I/Os are available in this SoC part.This flash has a size of 512KB.By searching A2F500M3G, you will find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 80MHz.Core architecture of ARM underpins the SoC meaning.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-FGG484M System On Chip (SoC) applications.

  • Special Issue Editors
  • ARM
  • Published Paper
  • Keyboard
  • Functional safety for critical applications in the industrial sectors
  • Deep learning hardware
  • Networked sensors
  • AC-input BLDC motor drive
  • USB hard disk enclosure
  • Smartphone accessories