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A2F500M3G-PQ208

208 Terminations0°C~85°C TJ 208 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F500M3G-PQ208
  • Package: 208-BFQFP
  • Datasheet: PDF
  • Stock: 340
  • Description: 208 Terminations0°C~85°C TJ 208 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/O1.5V (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 208-BFQFP
Surface Mount YES
Number of Pins 208
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 0.5mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F500M3G
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 22, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Organization 11520 CLBS, 500000 GATES
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Logic Blocks (LABs) 24
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Equivalent Gates 500000
Flash Size 512KB
Height Seated (Max) 4.1mm
Length 28mm
Width 28mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.There is a 208-BFQFP package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.It is part of the SmartFusion? series of system on a chips.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops, an important feature to keep in mind.Tray package houses this SoC system on a chip.MCU - 22, FPGA - 66 I/Os are available in this SoC part.It is recommended to use a 1.5V power supply.There are voltages higher than 1.575V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.425V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.There are 208 terminations in total and that really benefits system on a chip.This flash has a size of 512KB.Searching A2F500M3G will bring up system on chips with similar specs and purposes.During operation, the wireless SoC runs at a frequency of 80MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.208 pins are present on this computer SoC.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-PQ208 System On Chip (SoC) applications.

  • External USB hard disk/SSD
  • Industrial robot
  • Industrial Pressure
  • Networked sensors
  • Central inverter
  • Embedded systems
  • AC drive control module
  • RISC-V
  • Communication network-on-Chip (cNoC)
  • ARM Cortex M4 microcontroller