A3P600L-1FGG484

A3P600L-1FGG484 Overview

There are two packages that contain fpga chips: 484-BGA package and X package. Fpga chips is programmed wFpga chipsh 235 I/Os for transferring data in a more coherent manner. Surface Mount-connectors can be used to attach this FPGA module to the development board. This device is powered by a 1.14V~1.575V battery. The ProASIC3L series FPGA is a type of FPGA that belongs to the ProASIC3L family of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. In order to save space, this FPGA model has been contained in Tray. This device is equipped with 110592 RAM bits in terms of its RAM si110592e. For related parts, use its base part number A3P600L. For the program to work properly, the RAM si13.5kBe of this FPGA module must reach 13.5kB GB in order to ensure normal operation. The device is designed with 484 pins in total. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. This module is capable of operating at a maximum temperature of 70°C. Operating temperatures should exceed 0°C. 600000 gates make up the basic block of its construction. During the process of storing and transferring data, 13824 registers are used. Fpga semiconductor supports the maximal supply voltage of 1.26V. Using 1.14V as the minimum supply voltage, fpga semiconductor can operate. Fpga semiconductor is possible for this FPGA to reach speeds of up to 892.86MHz. During operation, it uses 5mA of supply current. As a supplier, 484-FPBGA (23x23) is responsible for the package of its devices.

A3P600L-1FGG484 Features

235 I/Os
Up to 110592 RAM bits
484 LABs/CLBs
70°C gates
13824 registers

A3P600L-1FGG484 Applications

There are a lot of Microsemi Corporation A3P600L-1FGG484 FPGAs applications.

• Audio
• Wireless Communications
• Security systems
• Industrial Ethernet
• Computer hardware emulation
• Embedded Vision
• High Performance Computing
• Distributed Monetary Systems
• Consumer Electronics
• Ecosystem