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ADD8709ASTZ-REEL7

ADD8709ASTZ-REEL7 datasheet pdf and Logic - Buffers, Drivers, Receivers, Transceivers product details from Rochester Electronics, LLC stock available at Utmel


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-ADD8709ASTZ-REEL7
  • Package: 48-LQFP
  • Datasheet: PDF
  • Stock: 706
  • Description: ADD8709ASTZ-REEL7 datasheet pdf and Logic - Buffers, Drivers, Receivers, Transceivers product details from Rochester Electronics, LLC stock available at Utmel(Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 48-LQFP
Surface Mount YES
Packaging Tape & Reel (TR)
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 48
Terminal Finish MATTE TIN
Subcategory Buffer Amplifier
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 18
Supply Voltage 16V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 48
JESD-30 Code S-PQFP-G48
Qualification Status COMMERCIAL
Operating Temperature (Max) 100°C
Operating Temperature (Min) -40°C
Temperature Grade INDUSTRIAL
Slew Rate 6 V/us
Amplifier Type BUFFER
Average Bias Current-Max (IIB) 1.5μA
Supply Voltage Limit-Max 18V
-3db Bandwidth 4.5MHz
Input Offset Voltage-Max 15000μV
Output Current-Min 0.15A
Height Seated (Max) 1.6mm
Length 7mm
Width 7mm
RoHS Status ROHS3 Compliant

ADD8709ASTZ-REEL7 Overview


Logical driver uses a neat 48-LQFP package. Tape & Reel (TR) external packaging. Available in Surface Mount. 48 terminations with different functions. Buffer IC reuqires a supply voltage of 16V. 48 pins are set with the electric part. Specifically, digital transciever is a kind of Buffer Amplifier. The high limit of ambient temperature for transceiver is 100°C. The bottom temp to go with the electronic parts should be -40°C.

ADD8709ASTZ-REEL7 Features


Buffer Amplifier

ADD8709ASTZ-REEL7 Applications


There are a lot of Rochester Electronics, LLC ADD8709ASTZ-REEL7 Buffers & Transceivers applications.

  • Data center
  • Wireless communication
  • Cell phones
  • Wireless transmission
  • Wireless security systems
  • Metro access rings
  • Satellite ground stations
  • Wireless access points
  • Optical sub-assembly (OSA)
  • Indoor ad hoc meeting