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ADSP-21060KSZ-133

CPLD SHARC? Series 240-BFQFP Exposed Pad


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-ADSP-21060KSZ-133
  • Package: 240-BFQFP Exposed Pad
  • Datasheet: -
  • Stock: 812
  • Description: CPLD SHARC? Series 240-BFQFP Exposed Pad (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 240-BFQFP Exposed Pad
Supplier Device Package 240-MQFP-EP (32x32)
Operating Temperature 0°C~85°C
Packaging Tray
Series SHARC®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Floating Point
Interface Host Interface, Link Port, Serial Port
Voltage - I/O 5.00V
Non-Volatile Memory External
Voltage - Core 5.00V
On Chip Data RAM 512kB
Clock Rate 33MHz
RoHS Status ROHS3 Compliant

ADSP-21060KSZ-133 Overview


An electronic component available in package 240-BFQFP Exposed Pad.It has a packaging style of Tray.Due to its membership in Floating Point, it is ideally suited for a wide range of uses.The mounting is carried out in the direction of Surface Mount.By operating the device at the temperature of 0°C~85°C, a normal operation is ensured.In analog circuits, the analog voltage range 5.00V represents the voltage range that is available for input or output.Digital signal processors such as this one are included in the SHARC? series.

ADSP-21060KSZ-133 Features


Supplied in the 240-BFQFP Exposed Pad package

ADSP-21060KSZ-133 Applications


There are a lot of Rochester Electronics, LLC ADSP-21060KSZ-133 DSP applications.

  • Vehicle electronics
  • Tomography technology
  • Smart camera
  • Spectral density estimation
  • Airplanes
  • Smart phones
  • Radio detection and rangin systems
  • Speech processing
  • Dam design
  • Image compression