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ADSP-2184LBST-160

CPLD ADSP-21xx Series 100-LQFP


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-ADSP-2184LBST-160
  • Package: 100-LQFP
  • Datasheet: -
  • Stock: 488
  • Description: CPLD ADSP-21xx Series 100-LQFP (Kg)

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IMPORTANT NOTICE

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 100-LQFP
Supplier Device Package 100-LQFP (14x14)
Operating Temperature -40°C~85°C
Packaging Tray
Series ADSP-21xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed Point
Interface Host Interface, Serial Port
Voltage - I/O 3.30V
Non-Volatile Memory External
Voltage - Core 3.30V
On Chip Data RAM 20kB
Clock Rate 40MHz
RoHS Status Non-RoHS Compliant

ADSP-2184LBST-160 Overview


It is a kind of electronic component that comes in a package of 100-LQFP.Tray is the packaging method provided.Due to its membership in Fixed Point, it is ideally suited for a wide range of uses.Surface Mount is mounted in a manner that allows it to be moved.At the temperature of -40°C~85°C, the device is guaranteed to operate normally.3.30V refers to the range of analog voltages that can be input or output.The ADSP-21xx series incorporates this digital signal processor.

ADSP-2184LBST-160 Features


Supplied in the 100-LQFP package

ADSP-2184LBST-160 Applications


There are a lot of Rochester Electronics, LLC ADSP-2184LBST-160 DSP applications.

  • Telephone conversations
  • Audio signal
  • Smart phones
  • Streaming music
  • Consumer electronic gadgets
  • Instrument modeling
  • 3D tomography and imaging processing
  • Financial signals
  • Speech processing and recognition
  • Geophysical processing