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  • AK7742EQ

AK7742EQ

CPLD AK7742 18.6MHz 48-LQFP


  • Manufacturer: AKM Semiconductor Inc.
  • Origchip NO: 23-AK7742EQ
  • Package: 48-LQFP
  • Datasheet: -
  • Stock: 799
  • Description: CPLD AK7742 18.6MHz 48-LQFP (Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 14 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 48-LQFP
Supplier Device Package 48-LQFP (7x7)
Operating Temperature -20°C~70°C TA
Packaging Tray
Published 2008
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Floating Point
Max Operating Temperature 70°C
Min Operating Temperature -20°C
Frequency 18.6MHz
Base Part Number AK7742
Interface I2C
Voltage - I/O 3.30V
Voltage - Core 1.80V
On Chip Data RAM 23.25kB
Clock Rate 18.6MHz
RoHS Status ROHS3 Compliant

AK7742EQ Overview


In electronic terms, it is a type of component that comes in the package of type 48-LQFP .Packaging is provided in the form of Tray.Due to its membership in Floating Point, it is ideally suited for a wide range of uses.In order to mount it, it must be in the direction of Surface Mount.It is recommended that the device operate at a temperature of -20°C~70°C TA to ensure its normal operation.This refers to the analog voltage range that can be input or output from 3.30V.Several related parts can be identified using its base part number, AK7742.It is specifically designed to operate with the frequency of 18.6MHz.The mounting method is Surface Mount.It is recommended that the operating temperature be lower than 70°C.-20°C should be exceeded as the operating temperature.

AK7742EQ Features


Supplied in the 48-LQFP package

AK7742EQ Applications


There are a lot of AKM Semiconductor Inc. AK7742EQ DSP applications.

  • Smart camera
  • Vibration signal processing
  • Telephone conversations
  • Biometrics
  • Tomography technology
  • Digital communications
  • Other sensor array processing
  • Vehicle electronics
  • 3D tomography and imaging processing
  • Biomedical engineering