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BAP50-04,215

BAP50-04,215 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available at Feilidi


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-BAP50-04,215
  • Package: TO-236-3, SC-59, SOT-23-3
  • Datasheet: PDF
  • Stock: 447
  • Description: BAP50-04,215 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available at Feilidi (Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Package / Case TO-236-3, SC-59, SOT-23-3
Surface Mount YES
Diode Element Material SILICON
Operating Temperature -65°C~150°C TJ
Packaging Tape & Reel (TR)
Published 1999
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
Terminal Finish Tin (Sn)
HTS Code 8541.10.00.70
Subcategory PIN Diodes
Technology POSITIVE-INTRINSIC-NEGATIVE
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number BAP50-04
Pin Count 3
JESD-30 Code R-PDSO-G3
Qualification Status Not Qualified
Number of Elements 2
Configuration SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Power Dissipation-Max 250mW
Diode Type PIN - 1 Pair Series Connection
Current - Max 50mA
JEDEC-95 Code TO-236AB
Capacitance @ Vr, F 0.5pF @ 5V 1MHz
Voltage - Peak Reverse (Max) 50V
Breakdown Voltage-Min 50V
Diode Capacitance-Nom 0.45pF
Resistance @ If, F 5Ohm @ 10mA 100MHz
Diode Capacitance-Max 0.6pF
Minority Carrier Lifetime-Nom 1.05 µs
Diode Res Test Current 0.5mA
Diode Res Test Frequency 100MHz
Diode Forward Resistance-Max 5Ohm
RoHS Status ROHS3 Compliant
See Relate Datesheet