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BAP50LX,315

BAP50LX,315 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available at Feilidi


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-BAP50LX,315
  • Package: SOD-882
  • Datasheet: PDF
  • Stock: 824
  • Description: BAP50LX,315 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available at Feilidi (Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Number of Elements 1
Power Dissipation-Max 150mW
Diode Type PIN - Single
Current - Max 50mA
Capacitance @ Vr, F 0.35pF @ 5V 1MHz
Voltage - Peak Reverse (Max) 50V
Breakdown Voltage-Min 50V
Frequency Band S B
Diode Capacitance-Nom 0.4pF
Resistance @ If, F 3Ohm @ 10mA 100MHz
Diode Capacitance-Max 0.55pF
Minority Carrier Lifetime-Nom 1 µs
Diode Res Test Current 0.5mA
Diode Res Test Frequency 100MHz
Diode Forward Resistance-Max 5Ohm
RoHS Status ROHS3 Compliant
Factory Lead Time 10 Weeks
Package / Case SOD-882
Surface Mount YES
Diode Element Material SILICON
Operating Temperature -65°C~150°C TJ
Packaging Tape & Reel (TR)
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Terminal Finish Tin (Sn)
HTS Code 8541.10.00.70
Subcategory PIN Diodes
Technology POSITIVE-INTRINSIC-NEGATIVE
Terminal Position BOTTOM
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BAP50
Pin Count 2
JESD-30 Code R-PBCC-N2
Qualification Status Not Qualified
See Relate Datesheet