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BBL-119-G-F

SAMTEC BBL-119-G-F Stacking Board Connector, Low Profile, BBL Series, 19 Contacts, Header, 2.54 mm, Solder, 1 Rows


  • Manufacturer: Samtec Inc.
  • Origchip NO: 680-BBL-119-G-F
  • Package: -
  • Datasheet: PDF
  • Stock: 613
  • Description: SAMTEC BBL-119-G-F Stacking Board Connector, Low Profile, BBL Series, 19 Contacts, Header, 2.54 mm, Solder, 1 Rows (Kg)

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Shipping Cost

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Contact Material Bronze
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Liquid Crystal Polymer (LCP)
Housing Material Plastic
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2008
Series BBL
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 19
Number of Rows 1
Gender Male
Additional Feature LOW PROFILE
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Male Pin
Mixed Contacts NO
Option GENERAL PURPOSE
Insulation Height 0.085 2.15mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Number of Conductors ONE
Reference Standard UL
Reliability COMMERCIAL
Contact Length - Post 0.125 3.18mm
Shrouding Unshrouded
Number Of PCB Rows 1
Contact Finish - Post Nickel
Contact Length - Mating 0.122 3.10mm
PCB Contact Pattern RECTANGULAR
Mating Information MULTIPLE MATING PARTS AVAILABLE
Overall Contact Length 0.332 8.43mm
Row Spacing 2.54 mm
Height 2.16mm
Length 48.3mm
Width 2.54mm
Plating Thickness 20μin
Contact Finish Thickness - Mating 20.0μin 0.51μm
Contact Finish Thickness - Post 50.0μin 1.27μm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
See Relate Datesheet