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BGM15LA12E6327XTSA1

BGM15LA12E6327XTSA1 datasheet pdf and RF Amplifiers product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • Origchip NO: 376-BGM15LA12E6327XTSA1
  • Package: 12-UFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 121
  • Description: BGM15LA12E6327XTSA1 datasheet pdf and RF Amplifiers product details from Infineon Technologies stock available at Feilidi (Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 12-UFQFN Exposed Pad
Surface Mount YES
Packaging Tape & Reel (TR)
Published 2015
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 12
Terminal Finish Gold/Nickel (Au/Ni)
HTS Code 8542.39.00.01
Voltage - Supply 2.2V~3.3V
Terminal Position BOTTOM
Terminal Form BUTT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 2.8V
Terminal Pitch 0.4mm
Frequency 700MHz~1GHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XBCC-B12
Operating Temperature (Max) 85°C
Operating Temperature (Min) -40°C
Temperature Grade INDUSTRIAL
Test Frequency 925MHz~960MHz
Current - Supply 4.9mA
Halogen Free Halogen Free
Gain 17.3dB
Telecom IC Type TELECOM CIRCUIT
RF Type LTE, W-CDMA
Noise Figure 1.1dB
P1dB -8dBm
Height Seated (Max) 0.65mm
Length 1.9mm
Width 1.1mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
See Relate Datesheet