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BU8763FV-E2

16 Pin BU8763 Telecom device1 Circuits


  • Manufacturer: ROHM Semiconductor
  • Origchip NO: 687-BU8763FV-E2
  • Package: 16-LSSOP (0.173, 4.40mm Width)
  • Datasheet: PDF
  • Stock: 277
  • Description: 16 Pin BU8763 Telecom device1 Circuits(Kg)

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Details

Tags

Parameters
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 16-LSSOP (0.173, 4.40mm Width)
Number of Pins 16
Supplier Device Package 16-SSOP-B
Operating Temperature -20°C~70°C
Packaging Tape & Reel (TR)
Published 2006
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature 70°C
Min Operating Temperature -20°C
Power (Watts) 450mW
Max Power Dissipation 450mW
Voltage - Supply 2.7V~3.6V
Base Part Number BU8763
Function Melody LSI
Number of Circuits 1
RoHS Status ROHS3 Compliant
Lead Free Lead Free

BU8763FV-E2 Overview


To save board space, the 16-LSSOP (0.173, 4.40mm Width) package is used.To pack telecommunications equipment, the way of Tape & Reel (TR) is used.A Surface Mount mounting type is used.1 circuits make up this telecom IC .Wtelecom IC's efficiencyh a high supply voltage, 2.7V~3.6V can be operated more efficiently.Using -20°C~70°C as the operating temperature can result in reliable performance.Mounted in the direction of Surface Mount.Telecom interfaces contain 16 pins.BU8763 can be used to locate related parts based on telecom switching's base part number.Ensure normal operation by setting the temperature to -20°C minimum.70°C is set to the maximum value to ensure normal operation.

BU8763FV-E2 Features


Available in the 16-LSSOP (0.173, 4.40mm Width) package

BU8763FV-E2 Applications


There are a lot of ROHM Semiconductor BU8763FV-E2 Telecom applications.

  • SDH/SONET multiplexers
  • Channel Banks
  • Fiber In The Loop (FITL)
  • Cable Modem
  • Stations
  • Fault Tolerant Systems
  • Remote wireless modules
  • Digital cross connects (DSX-1)
  • Microwave transmission systems
  • SDH Multiplexers