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CGB4B1X6S1C225M055AC

CGB4B1X6S1C225M055AC datasheet pdf and Ceramic Capacitors product details from TDK Corporation stock available at Utmel

Manufacturer: TDK Corporation
Origchip NO: 769-CGB4B1X6S1C225M055AC
Package: 0805 (2012 Metric)
Datasheet: PDF
Stock: 700
Description: CGB4B1X6S1C225M055AC datasheet pdf and Ceramic Capacitors product details from TDK Corporation stock available at Utmel(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Terminal Shape	WRAPAROUND
Number of Pins	112
Operating Temperature	-55°C~105°C
Packaging	Tape & Reel (TR)
Published	2012
Series	CGB
Size / Dimension	0.079Lx0.049W 2.00mmx1.25mm
Tolerance	±20%
JESD-609 Code	e3
Feature	Low Profile
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	2
Termination	SMD/SMT
ECCN Code	EAR99
Temperature Coefficient	X6S
Terminal Finish	Tin (Sn) - with Nickel (Ni) barrier
Composition	Ceramic
Applications	General Purpose
HTS Code	8532.24.00.20
Capacitance	2.2μF
Voltage - Rated DC	16V
Frequency	48MHz
Case Code (Metric)	2012
Case Code (Imperial)	0805
Temperature Characteristics Code	X6S
Multilayer	Yes
Interface	EBI/EMI, I2C, IrDA, SPI, UART, USART, USB
Memory Size	128kB
Oscillator Type	Internal
Number of I/O	93
Memory Type	FLASH
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Core Architecture	ARM
Height	550μm
Thickness (Max)	0.022 0.55mm
RoHS Status	ROHS3 Compliant
Factory Lead Time	20 Weeks
Mounting Type	Surface Mount, MLCC
Package / Case	0805 (2012 Metric)
Surface Mount	YES