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  • CMX860D1

CMX860D1

28 TerminationsTelecom device1 Circuits


  • Manufacturer: CML Microcircuits
  • Origchip NO: 183-CMX860D1
  • Package: 28-SOIC (0.295, 7.50mm Width)
  • Datasheet: -
  • Stock: 843
  • Description: 28 TerminationsTelecom device1 Circuits(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 28-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Operating Temperature -40°C~85°C
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 28
Terminal Finish Matte Tin (Sn)
Power (Watts) 740mW
Subcategory Other Telecom ICs
Voltage - Supply 2.7V~5.5V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3V
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code R-PDSO-G28
Function Transceiver
Qualification Status Not Qualified
Power Supplies 3/5V
Interface C-Bus
Number of Circuits 1
Current - Supply 9mA
Telecom IC Type DTMF SIGNALING CIRCUIT
Height Seated (Max) 2.67mm
Width 7.425mm
RoHS Status ROHS3 Compliant

CMX860D1 Overview


Space is saved on the board by using the 28-SOIC (0.295, 7.50mm Width) package.In this case, Surface Mount is the mounting type.This telecom IC is composed of 1 circuits.Providing 2.7V~5.5V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.At -40°C~85°C, reliable performance can be achieved.There are 28 terminations can be found in telecom switching configuration.The supply voltage it operates with is 3V.DTMF SIGNALING CIRCUIT is the type of IC it uses for telecom.A 9mA-volt supply current is used to operate telecom equipment .Other Telecom ICs subcategories telecommunications device .

CMX860D1 Features


Available in the 28-SOIC (0.295, 7.50mm Width) package
DTMF SIGNALING CIRCUIT as telecom IC type

CMX860D1 Applications


There are a lot of CML Microcircuits CMX860D1 Telecom applications.

  • T1 Rates PCM Line Interface
  • SONET/SDH terminal
  • T1/E1/J1 Multiplexer and Channel Banks
  • Wireless base stations
  • Central office
  • Interfaces to E3
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • Digital Cross-connect Systems (DCS)
  • Digital loop carrier (DLC)
  • Hybrid fiber coax (HFC)