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CS496122-IQZR

CPLD CobraNet? Series CS4961* 144-LQFP


  • Manufacturer: Cirrus Logic Inc.
  • Origchip NO: 143-CS496122-IQZR
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: 335
  • Description: CPLD CobraNet? Series CS4961* 144-LQFP (Kg)

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Shipping Cost

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Delivery Time

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 20 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2005
Series CobraNet®
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed Point
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Base Part Number CS4961*
Interface ASI, CobraNet, EBI/EMI, HMI, SSAI, UART/USART
Voltage - I/O 3.30V
Non-Volatile Memory External
Voltage - Core 1.80V
On Chip Data RAM External
Clock Rate 120 MIPS
RoHS Status RoHS Compliant

CS496122-IQZR Overview


It is a type of electronic component available in package 144-LQFP.Packaging is provided in the form of Tape & Reel (TR).The fact that it belongs to the Fixed Point family means that it can be applied to a wide range of applications.It is mounted in the direction of Surface Mount as shown in the image below.By operating the device at the temperature of -40°C~85°C TA, a normal operation is ensured.The analog voltage range of 3.30V refers to the input or output voltage.There are several digital signal processors in the CobraNet? series, including this one.Many related parts can be identified by using the CS4961* part number as a base.Surface Mount is the method of mounting it.There should be a difference between 85°C and the operating temperature.It is recommended that the operating temperature exceeds -40°C.

CS496122-IQZR Features


Supplied in the 144-LQFP package

CS496122-IQZR Applications


There are a lot of Cirrus Logic Inc. CS496122-IQZR DSP applications.

  • Vehicle electronics
  • 3D tomography and imaging processing
  • Seismology
  • Automobiles
  • Automatic analysis system of EEG or ECG
  • Audio
  • Biomedical engineering
  • Electronic information engineering
  • TVs
  • Dam design