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CYP15G0403DXB-BGC

Telecom device4 Circuits


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-CYP15G0403DXB-BGC
  • Package: 256-LBGA Exposed Pad
  • Datasheet: PDF
  • Stock: 936
  • Description: Telecom device4 Circuits(Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 256-LBGA Exposed Pad
Supplier Device Package 256-BGA (27x27)
Operating Temperature 0°C~70°C
Packaging Tray
Series HOTlink II™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.135V~3.465V
Function Transceiver
Interface LVTTL
Number of Circuits 4
Current - Supply 900mA
RoHS Status Non-RoHS Compliant

CYP15G0403DXB-BGC Overview


In order to save space on the board, 256-LBGA Exposed Pad packages are used.Packing is done according to the Tray method.Mounting type Surface Mount is used.A 4 circuit is the heart of this telecom IC .3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.0°C~70°C is the operating temperature that can be set for reliable performance.Wit h a supply current of 900mA, telecom equipment operates.A lot of its functions of the telecommunication product are similar to those of the electronic parts in the HOTlink II? series.

CYP15G0403DXB-BGC Features


Available in the 256-LBGA Exposed Pad package

CYP15G0403DXB-BGC Applications


There are a lot of Rochester Electronics, LLC CYP15G0403DXB-BGC Telecom applications.

  • Add/Drop multiplexers (ADMs)
  • Short/Medium Loop
  • Router
  • Digital Cross-connect Systems (DCS)
  • Fractional T1/E1/J1
  • PCM Test Equipment
  • E1 Multiplexer
  • T1 Rates PCM Line Interface
  • Home Side Box
  • T2 Rates PCM Line Interface