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DP8421AV-25
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Shipping Cost
Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The
basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and
country.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 68-LCC (J-Lead) |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Voltage - Supply | 4.5V~5.5V |
| Reach Compliance Code | unknown |
| Base Part Number | DP8421 |
| Pin Count | 68 |
| uPs/uCs/Peripheral ICs Type | MEMORY CONTROLLER, DRAM |
| Controller Type | Dynamic RAM (DRAM) |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
DP8421AV-25 Overview
There is a packaging of Tube materials included in the package. For the purpose of saving board space, it is provided in the 68-LCC (J-Lead). Having high quality and reliable performance, the Dynamic RAM (DRAM) is a type of product. 0°C~70°C should be the operating temperature. It requires a voltage of 4.5V~5.5V in order to operate normally. It is mounted based on the technique of Surface Mount. The base part number DP8421 can be used to locate other similar electronic parts. As a result, it is configured with 68 pins. There are no internal components within the uPs/uCs/peripheral IC, so it is integrated with MEMORY CONTROLLER, DRAM.
DP8421AV-25 Features
Available in the 68-LCC (J-Lead) package
Dynamic RAM (DRAM) as controller type
Operating temperature of 0°C~70°C
DP8421AV-25 Applications
There are a lot of Texas Instruments DP8421AV-25 Memory Controllers applications.
- Industrial USB Flash Drive
- Computers
- Internet Appliances
- Multi-Chip-Packages (MCP)
- Embedded modules including U.2, M.2, MO-297 and MO-300
- Solid State Disks (SSD)
- eMMC embedded Flash
- Facsimile, Printers and Photocopiers
- Multi-Chip-Modules (MCM)
- Point-of-Sale Systems